Probe / Tube Sealing
Application Case Studies
Industry: Semiconductor - Wafer Processing
Application:
Wet Wafer Processing RTD
Customer Requirement
Our customer is an equipment manufacturer (OEM) in the semiconductor industry. They describe themselves as a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing.
They are using an RTD to monitor an ultra high purity wet wafer cleaning process. There processes are described as either front-end-of-line (FEOL) or back- end-of-line (BEOL) processing. Typical FEOL processes include critical clean and etch, post-ash clean and photo resist strip, particle removal and dry film strip. Typical BEOL processes also include post-ash clean and particle removal.
They are currently buying an RTD unit with a black Teflon coating on the probe, 5 per machine. They are quite concerned with cleanliness (especially) and accuracy. They want to replace the black Teflon coating as it creates a "less clean" look to their customers. They specify a "class A" RTD element (+/- .15° C @ 0° C). Process contamination by the black Teflon into the process could cost the equipment users to lose a batch of product, costing several thousand dollars.
Conax Solution
We are offering an "ultra high purity" clear Teflon probe covering. This creates a "cleaner" (= better) impression with their customers from the "contamination" viewpoint, along with an actually more pure version of Teflon. We are also offering a "standard purity" version of the same thing, using clear Teflon also. The high purity Teflon is more costly than the standard purity version. They are hesitant to spend the extra money if they can get the clear Teflon for about the same amount they are paying now
